ASIA unversity:Item 310904400/1782
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    Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/1782


    Title: 並聯式軟性電荷幫浦設計之模擬分析
    Analysis of flexible parallel charge pump
    Authors: 林佩誼
    Contributors: 光電與通訊學系碩士班
    Date: 2008
    Issue Date: 2009-10-12 11:47:35 (UTC+0)
    Publisher: 亞洲大學
    Abstract: 本論文主要討論以TFT為電路開關的被動式射頻標籤晶片前端之AC-DC整流電路，電路結構為並聯式電荷幫浦(Parallel Charge Pump)。
    首先以NI Multisim電路模擬軟體針對以蕭特基二極體為元件的並聯式電荷幫浦整流電路進行模擬，依模擬結果計算電路的功率轉換效率(PCE)，之後以Smart-Spice電路模擬軟體模擬以薄膜電晶體為元件的並聯式電荷幫浦整流電路，並使用電路分析推導的整流效率PCE方程式，作為後續研究整體RF整流電路效能的考量點。模擬之因素在於評估TFT元件模型能否替代目前以CMOS 元件模型為主之標籤組成電路的可行性。展望未來，期許標籤晶片電路可進而結合軟性電子相關技術呈現以印製或噴墨方式製作，成為印製式軟性RFID電子標籤。
    Appears in Collections:[Department of Photonics and Communication Engineering] Theses & dissertations

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