Water-cooling Radiator for CPU with Innovative Design: Experiments and Simulation

ASIAIR > College of Creative Design > Department of Creative Product Design > Journal Article > Item 310904400/115295

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Title:	Water-cooling Radiator for CPU with Innovative Design: Experiments and Simulation
Authors:	林信宏;HUNG, LIN HSIN
Contributors:	創意設計學院創意商品設計學系
Keywords:	radiator fan, water-cooled thermal module, numerical simulation, experimental measurement, CPU radiator
Date:	2022-04-01
Issue Date:	2023-03-29 01:27:42 (UTC+0)
Publisher:	亞洲大學
Abstract:	A new water-cooling radiator is proposed for a CPU with an area of 28.7 mm2 and a power of 100 W. The performance was of the radiator simulated with two different types of fan blades and compared with that of a conventional solid-cooling radiator. Then, the simulation results were validated through an experiment in which the temperature and thermal resistance of the radiator were measured at different fan and water pump speeds. The results showed that the thermal resistance of the water-cooling radiator was 0.073–0.15 ℃/W at the maximum power of 100 W and a fan speed of 1000?3000 rpm. The proposed water-cooling radiator improves the cooling effect and has high efficiency. The heat dissipation of the CPU was improved with forwardinclined fan blades and the increased fan speed and water flow rate of the water-cooling system. The proposed water-cooling radiator with the fan blades is expected to improve the overall efficiency of CPUs and be applied to the manufacture of radiators for CPUs.
Appears in Collections:	[Department of Creative Product Design] Journal Article

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