Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process

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題名:	Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
作者:	Chun-Ming Yang;Kuo-Ping Lin;Kuen-Suan Chen
貢獻者:	經營管理學系
日期:	2019-06
上傳時間:	2019-11-15 03:07:46 (UTC+0)
摘要:	The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry. The integrated-circuit (IC) packaging industry chain adopts a professional division of labor model, and each process (including wafer dicing, die bonding, wire bonding, molding, and other subsequent processes) must have enhanced process capabilities to ensure the quality of the final product. Increasing quality can also lower the chances of waste and rework, lengthen product lifespan, and reduce maintenance, which means fewer resources invested, less pollution and damage to the environment, and smaller social losses. This contributes to the creation of a green process. This paper developed a complete quality evaluation model for the IC packaging molding process from the perspective of a green economy. The Six Sigma quality index (SSQI), which can fully reflect process yield and quality levels, is selected as a primary evaluation tool in this study. Since this index contains unknown parameters, a confidence interval based fuzzy evaluation model is proposed to increase estimation accuracy and overcome the issue of uncertainties in measurement data. Finally, a numerical example is given to illustrate the applicability and effectiveness of the proposed method.
關聯:	Applied Sciences-Basel
顯示於類別:	[經營管理學系 ] 期刊論文

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