ASIA unversity:Item 310904400/101767
English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 94286/110023 (86%)
造訪人次 : 21674406      線上人數 : 468
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    ASIA unversity > 資訊學院 > 資訊工程學系 > 期刊論文 >  Item 310904400/101767


    請使用永久網址來引用或連結此文件: http://asiair.asia.edu.tw/ir/handle/310904400/101767


    題名: Ultra High Voltage Device RESURF LDMOS Technology on Drain- and Source-Centric Design Optimization
    作者: 楊紹明;Yang, Shao-Ming;*;Chen, Po-An;Chen, Po-An;Pan, CH;Pan, CH
    貢獻者: 資訊工程學系
    日期: 2016-11
    上傳時間: 2016-11-08 02:35:24 (UTC+0)
    摘要: We present drain and source-centric design optimizations of a linear P-top and dual-channel conduction path LDMOS
    (lateral double-diffused metal-oxide semiconductor) structure for low specific on-resistance (Ron.sp) powered transistor devices. The
    design was simulated using TCAD tools, and a real silicon device was fabricated successfully in accordance with the simulation. The
    3D effect in the cylindrical layout with the linear P-top doping profiles was designed using an analytical model to obtain optimal
    charged balance for the drain- and source-centric regions. The silicon result, with an optimized P-top doping process window, achieved
    a breakdown voltage (BV) of 842 V, which was higher than 800 V. Thus, the use of a dual-channel conduction path technique with an
    N-top layer implanted over the P-top can improve Ron.sp by 25% without compromising BV.
    關聯: Applied Mathematics & Information Sciences
    顯示於類別:[資訊工程學系] 期刊論文

    文件中的檔案:

    檔案 大小格式瀏覽次數
    index.html0KbHTML567檢視/開啟


    在ASIAIR中所有的資料項目都受到原著作權保護.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回饋