Effect of Time and Temperature on Epitaxy Growth

ASIAIR > College of Computer Science > Department of Computer Science and Information Engineering > Journal Artical > Item 310904400/100077

Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/100077

Title:	Effect of Time and Temperature on Epitaxy Growth
Authors:	Aanand(Aanand);Sheu), 許健(Gene;Yang)*, 楊紹明(Shao-Ming;Lai), 賴秋仲(Ciou-Jhong;Imam), Syed(Syed Sarwar
Contributors:	資訊工程學系
Date:	2016-03
Issue Date:	2016-08-08 03:54:17 (UTC+0)
Abstract:	The growth rate of epitaxy depends primarily on parameters such as source gas deposition temperature pressure and concentration. Most microelectronic circuits fabrication that use epitaxial wafers require a lightly epitaxial layer (1014-1017 atom/cm3) on a heavily doped substrate (1019-1021 atom/cm3). The distribution of vacancies and interstitials is important for the distribution of the high surface concentration enhancement of tail diffusivity and oxidation enhanced diffusion. We present the auto doping during the epitaxy growth process which is being ignored most of the time during the device fabrication. Also the defects which are formed during the growth of epitaxy. The present simulation solves for the transient interstitials distribution assuming that interstitials are at equilibrium with vacancies.
Relation:	China Semiconductor Technology International Conference
Appears in Collections:	[Department of Computer Science and Information Engineering] Journal Artical

Files in This Item:

File	Size	Format
index.html	0Kb	HTML	328	View/Open